View ZICM357P2-1_3602247.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

page 1 meshconnect? em357 module description cels meshconnect? em357 module combines high perfor - mance rf solution with the market's premier zigbee stack. the addition of on board memory enables o ver- t he- a ir (ota) programming without the need for additional in system memory. the integrated power amplifer maximizes range and perfor - mance. the small module footprint makes it suitable for a wide range of zigbee applications. the meshconnect em357 mod - ule is certifed and qualifed enabling customers to accelerate time to market by greatly reducing the design and certifcation phases of development. cels meshconnect? em357 module (ZICM357P2-1) is based on the ember em357 zigbee compliant soc ic. the ic is a single-chip solution, compliant with zigbee specifcations and ieee 802.15.4, a complete wireless solution for all zigbee applications. the ic consists of an rf transceiver with the baseband modem, a hardwired mac and an embedded 32-bit arm? cortex?-m3 microcontroller with internal ram (12kb) and flash (192kb) memory. the device provides numerous general-purpose i/o pins and peripheral functions such as timers and uarts. the meshconnect em357 module adds a power amplifer (pa) to increase range up to 2.5 miles , provide more reliable trans - mission, and reduce the number of nodes in your network. it is especially useful for open outdoor applications where the nodes are physically far apart or for indoor use where the nodes have to operate in a noisy rf environment. the modules outstand - ing 120db link budget ensures high quality connections even in such harsh environments. the meshconnect em357 module also integrates an 1mb flash memory for over-the-air program updates , making this device ready for smart energy applications. integrated transceiver modules for zigbe e/ ieee 802.15. 4 development kit available: zicm357p2-kit1-1 the information in this document is subject to change without notice, please confrm data is current document no: 0008-00-07-00-000 (issue a) date published: january 21, 2011 data sheet ordering information part number order number description meshconnect ? em357 module zicm 357p2 -1 + 20 dbm output power, pcb trace a ntenna ZICM357P2-1 c + 20 dbm output power, with u.fl connector for external antenna zicm357p2-kit1-1 + 20 dbm engineering development kit ? flash memory: 192 kb (em357 internal) 1mb (on module board) ? 12 kb sram ? 32-bit arm? cortex ? -m3 ? up to 23 gpio pins ? spi (master/slave), twi, uart ? timers, serial wire/jtag interface ? 5-channel 14-bit adc m e shc o n n ect ? em357 module ZICM357P2-1 ember em357 transceiver based module ? high rf performance: up to 120 db rf link budget rx sensitivity: -100 dbm rf tx power: +20 dbm ? data rate: 250 kbps ? small footprint: 1 x 1.41 (25.4 mm x 35.9 mm) ? advanced power management scheme w/ deep sleep mode features ? integrated pcb trace antenna optional u.fl external antenn a ? 15 rf channels ? up to 13,000 feet of range ? aes encryption ? fcc, ce and ic certifcations ? rohs compliant applications ? smart energy / grid markets smart meters ? building automation and control ? home automation and control thermostats displays energy management security devices hvac control lighting control ? general zigbee wireless sensor networking ? transmit power +20dbm ? 1mb additional fash for over-the-air programming ? +120 db rf link budget ? range up to 2.5 miles www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 2 module block diagram ember em357 em357 module balun pa balun spi bus development kit cel's development kit assist s users in both evaluation and development. as a stand-alone radio system, the kit allows users to place the modules into the target environ - ment and evaluate performance on-site. the development kit also serves as an invaluable aid in application develop - ment. through the many interface headers on the board, the user has access to all of the meshconnect module pins, enabling easy connection to target systems for ap - plication development. the interface board features a serial communication inter - face, a power management module, and peripherals such as a buzzer, a temperature sensor, push-button switches, leds, and gpio headers. for more detail information regarding meshconnect development kits, refer to the respective development kit user guides documents. (available at cels website http://www.cel.com ) kit contents: ? evaluation boards w/module (2) ? usb cables (1) ? aa batteries (4) ? software & technical information cd (1) m e shc o n n ect ? em357 module development kit development kit ordering information part number order number description meshconnect ? em357 module development kit zicm357p2-kit1-1 +20 dbm engineering development kit 24 mhz pwr reg flash 1mb xtal radio micro processor ant castellation edge connector www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 3 introduction and overview description .............................................................................................................................................................................................. 1 features .................................................................................................................................................................................................. 1 applications ............................................................................................................................................................................................ 1 ordering information ............................................................................................................................................................................. 1 module block diagram ........................................................................................................................................................................... 2 development kit ..................................................................................................................................................................................... 2 system level function transceiver ic ......................................................................................................................................................................................... 4 additional flash memory ....................................................................................................................................................................... 4 antenna ................................................................................................................................................................................................... 4 power amplifer ....................................................................................................................................................................................... 4 electrical specifcation absolute maximum ratings ................................................................................................................................................................... 5 recommended (operating condition) .................................................................................................................................................. 5 dc characteristics .................................................................................................................................................................................. 5 rf characteristics .................................................................................................................................................................................. 5 pin signal & interfaces pin signals i/o confguration ................................................................................................................................................................ 6 i/o pin assignment ................................................................................................................................................................................. 6 software/firmware .................................................................................................................................................................................. 8 module dimensions ................................................................................................................................................................................ 9 module footprint .................................................................................................................................................................................... 9 processing ......................................................................................................................................................................................... 11 agency certifcations ................................................................................................................................................................... 12 shipment, storage & handling ................................................................................................................................................. 14 references & revision history ................................................................................................................................................. 15 table of contents www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 4 transceiver ic the meshconnect em357 module uses the ember em357 transceiver ic. this ic incorporates the rf transceiver with the baseband modem, a hardwired mac, and an embedded arm? cortex?-m3 microcontroller, offering an excellent low cost high performance solution for all ieee 802.15.4 / zigbee applications. for more information about the ember em357 ic, visit http://www.ember.com additional flash memory the meshconnect em357 module incorporates an additional 1mb external flash memory for over-the-air program up - dates. the flash memory communicates over the em357s second serial controller using spi. the fash memory is wired to the following castellation pins: pa0 - sc2mosi pa1 - sc2miso pa2 - sc2sclk pa3 - sc2nssel wp - flash memory write protect line (has internal pull-up resistor, but not connected to the em357) the instruction set for the flash memory is similar to the micron m25p80. note that in order to achieve the specifed sleep current for the module, it is necessary to send a deep power-down command to the flash memory. see http://www.micron.com for more information on the instruction set. antenna cels meshconnect modules include an integrated printed circuit board (pcb) trace antenna. an optional u.fl connec - tor can be specifed, providing connection to a 50-ohm external antenna of the user s choice. see ordering information on page 1. the pcb antenna employs an inverted f-antenna topology that is compact and highly effcient. to maximize range, an adequate ground plane must be provided on the host pcb. correctly positioned, the ground plane on the host pcb will contribute signifcantly to the antenna performance (it should not be directly under the inverted f-antenna). the position of the module on the host board and overall design of the product enclosure contribute to antenna performance. poor design affects radiation patterns and can result in refection, diffraction, and/or scattering of the transmitted signal. here are some design guidelines to help ensure antenna performance: ? never place the ground plane or route copper traces directly underneath the antenna portion of the module. ? never place the antenna close to metallic objects. ? in the overall design, ensure that wiring and other components are not placed near the antenna. ? do not place the antenna in a metallic or metalized plastic enclosure. ? keep plastic enclosures 1cm or more from the antenna in any direction. for optimum antenna performance, the meshconnect modules should be mounted with the pcb trace antenna overhanging the edge of the host board. to further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. the installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. cel can provide assistance with your pcb layout. power amplifier the meshconnect em357 module includes a power amplifer (pa). this pa delivers high effciency, high gain, and high output power (pout = +20.0 dbm typ) to provide an extended range and reliable transmission for fewer nodes in a network. the pa is connected to the alternate em357 ic tx output, so em357 tx power modes 2 or 3 must be used to achieve the specifed output power. www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 5 absolute maximum ratings description meshconnect ? em357 module unit min max power supply voltage (v dd ) -0.3 3.6 vdc voltage on any i/o line -0.3 v dd + 0.3 vdc rf input power C 15 dbm storage temperature range -40 125 c refow soldering temperature C 260 c note: exceeding the maximum ratings may cause permanent damage to the module or devices. recommended (operating conditions) description meshconnect ? em357 module unit min typ max power supply voltage (v dd ) 2.7 3.3 3.6 v input frequency 2405 C 2475 mhz ambient temperature range -40 25 85 c dc characteristics (@ 25c, v dd = 3.3v, zicm357p2 tx power mode 2, unless otherwise noted) description meshconnect ? em357 module unit min typ max transmit mode current C 170 C ma receive mode current C 28 C ma sleep mode current C 6 C a rf characteristics (@ 25c, v dd = 3.3v, zicm357p2 tx power mode 2, unless otherwise noted) description meshconnect ? em357 module unit min typ max general characteristics rf frequency range 2405 C 2475 mhz rf channels 11 C 25 C frequency error tolerance -96.2 C 96.2 khz transmitter maximum output power C 20 C dbm minimum output power C -40 C dbm offset error vector magnitude C 15 35 % receiver sensitivity (1% per, boost mode) C -100 -94 dbm sensitivity (1% per, normal mode) C -98 -92 dbm saturation (maximum input level) 0 C C dbm www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 6 pin signals i/o port configuration meshconnect module has 56 edge i/o interfaces for connection to the users host board. the meshconnect module dimensions shows the layout of the 56 edge castellations. meshconnect i/o pin assignments cel meshconnect em357 module pin number ember em357 ic pin number name notes 1 49 ground 2 n/c wp flash memory write protect (internal pull-up) 3 21 pa0 dedicated as sc2mosi due to flash memory 4 22 pa1 dedicated as sc2miso due to flash memory 5 24 pa2 dedicated as sc2sclk due to flash memory 6 25 pa3 reserved as sc2nssel for flash memory 7 49 ground 8 16, 23, 28, 37 vcc 9 12 reset actve low (input) 10 13 pc6 digital i/o osc32b - 32.768 khz crystal oscillator ntx_active - inverted tx_active signal 11 14 pc7 digital i/o osc32a - 32.768 khz crystal oscillator osc32_ext - digital 32.768 khz clock input source 12 18 pa7 digital i/o tim1c4 - timer 1 channel 4 output tim1c4 - timer 1 channel 4 input reg_en - external regulator open drain output 13 19 pb3 digital i/o tim2c3 - timer 2 channel 3 output tim2c3 - timer 2 channel 3 input sc1ncts - uart cts handshake of serial controller 1 sc1sclk - spi master/slave clock of serial controller 1 14 20 pb4 digital i/o tim2c4 - timer 2 channel 4 output tim2c4 - timer 2 channel 4 input sc1nrts - uart rts handshake of serial controller 1 sc1nssel - spi slave select of serial controller 1 15 26 pa4 digital i/o adc4 - adc input 4 pti_en - frame signal of packet trace interface (pti) tracedata2 - synchronous cpu trace data bit 2 16 27 pa5 digital i/o adc5 - adc input 5 pti_data - data signal of packet trace interface (pti) nbootmode - embedded serial bootloader actvaton out of rest tracedata3 - synchronous cpu trace data bit 3 17 29 pa6 digital i/o tim1c3 - timer 1 channel 3 output tim1c3 - timer 1 channel 3 input www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 7 18 30 pb1 digital i/o sc1miso - spi slave data out of serial controller 1 sc1mosi - spi master data out of serial controller 1 sc1sda - twi data of serial controller 1 sc1txd - uart transmit data of serial controller 1 tim2c1 - timer 2 channel 1 output tim2c1 - timer 2 channel 1 input 19 49 ground 20 49 ground 21 49 ground 22 31 pb2 digital i/o scimiso - spi master data in of serial controller 1 sc1mosi - spi slave data in of serial controller 1 sc1scl - twi clock of serial controller 1 sc1rxd - uart receive data of serial controller 1 tim2c2 - timer 2 channel 2 output tim2c2 - timer 2 channel 2 input 23 32 jtck jtag clock input from debugger swclk - serial wire clock input/output with debugger 24 33 pc2 digital i/o jtdo - jtag data out to debugger swo - serial wire output asynchronous trace output to debugger 25 nc no connect 26 34 pc3 digital i/o jtdi - jtag data in from debugger 27 35 pc4 digital i/o jtms - jtag mode select from debugger swdio - serial wire bidirectonal data to/from debugger 28 49 ground 29 36 pb0 digital i/o vref - adc reference output vref - adc reference input irqa - external interrupt source a traceclk - synchronous cpu trace clock tim1clk - timer 1 external clock input tim2msk - timer 2 external clock mask input 30 38 pc1 cc 31 40 pc0 digital i/o jrst - jtag reset input from debugger irqd - default external interrupt source d tracedata1 - synchronous cpu trace data bit 1 32 nc no connect 33 41 pb7 digital i/o adc2 - adc input 2 irqc - default external interrupt source c tim1c2 - timer 1 channel 2 output tim1c2 - timer 1 channel 2 input meshconnect i/o pin assignments (continued) cel meshconnect em357 module pin number ember em357 ic pin number name notes www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 8 software/firmware the meshconnect em357 module is an ideal platform for the emberznet pro, the industrys most deployed and feld proven zigbee compliant stack supporting the zigbee pro feature set. emberznet pro is a complete zigbee protocol software package containing all the elements required for mesh networking applications. for more information regarding the software development for this ic, visit http://www.ember.com the meshconnect development kit provides a guide on how to access the em357 ic and utilize the e mber software devel - opment environment. it also provides a point to point demo application (transfer data between 2 devices) to conduct a range test and supports low level peripheral tests. 34 42 pb6 digital i/o adc1 - adc input 1 irqb - external interrupt source b tim1c1 - timer 1 channel 1 output tim1c1 - timer 1 channel 1 input 35 43 pb5 digital i/o adc0 - adc input 0 tim2clk - timer 2 external clock input tim1msk - timer 1 external clock mask input 36 49 ground 37 49 ground 38 49 ground 39 nc no connect 40 nc no connect 41 nc no connect 42 nc no connect 43 nc no connect 44 nc no connect 45 49 ground 46 49 ground 47 49 ground 48 49 ground 49 49 ground 50 49 ground 51 49 ground 52 49 ground 53 49 ground 54 49 ground 55 49 ground 56 49 ground note: pc5 is not brought out to a castellation since it is required to control the p a. for additional pin-out details please reference ember's em357 ic data sheet. cel meshconnect em357 module pin number ember em357 ic pin number name notes meshconnect i/o pin assignments (continued) www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 9 module dimensions 1.000? 0.195? 0.903? 1.413? 0.062? 0.120? rf shield r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 pin 1 pin 19 pin 38 pin 56 em357 series arm 0000000000000 em357 module zicm357p2 for layout recommendation for optimum antenna performance , refer to antenna section in this document. 1.000? 0.195? 0.903? 1.413? 0.062? rf shield r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 pin 1 pin 19 pin 38 pin 56 em357 series arm r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 em357 series arm 0000000000000 em357 module zicm357p2 meshconnect w/p cb trace antenna meshconnect w / u.fl connector for external antenna www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 10 module land footprint note: unless otherwise specifed. dimensions are in inches [mm]. www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 11 processing recommended refow profle parameters values ramp up rate (from tsoakmax to tpeak) 3o/sec max minimum soak temperature 150oc maximum soak temperature 200oc soak time 60-120 sec tliquidus 217oc time above tl 60-150 sec tpeak 250oc time within 5o of tpeak 20-30 sec time from 25o to tpeak 8 min max ramp down rate 6oc/sec max pb-free solder paste use of no clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. note: the quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate ipc speci - fcation. see the latest ipc-a-610 acceptability of electronic assemblies, castellated terminations section. cleaning in general, cleaning the populated modules is strongly discouraged. residuals under the module cannot be easily removed with any cleaning process. ? cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. the combination of soldering fux residuals and encapsulated water could lead to short circuits between neighboring pads. water could also damage any stickers or labels. ? cleaning with alcohol or a similar organic solvent will likely food soldering fux residuals into the two housings, which is not accessible for post-washing inspection. the solvent could also damage any stickers or labels. ? ultrasonic cleaning could damage the module permanently. the best approach is to consider using a no clean solder paste and eliminate the post-soldering cleaning step. optical inspection after soldering the module to the host board, consider optical inspection to check the following: ? proper alignment and centering of the module over the pads. ? proper solder joints on all pads. ? excessive solder or contacts to neighboring pads, or vias. repeating refow soldering only a single refow soldering process is encouraged for host boards. wave soldering if a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 12 processing (continued) agency certifications hand soldering hand soldering is possible. when using a soldering iron, follow ipc recommendations (reference document ipc-7711) rework the meshconnect module can be unsoldered from the host board. use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak refow temperature of 250 oc. caution if temperature ramps exceed the refow temperature profle, module and component damage may occur due to thermal shock. avoid overheating. warning never attempt a rework on the module itself, e.g. replacing individual components. such actions will terminate warranty coverage. additional grounding attempts to improve module or system grounding by soldering braids, wires, or cables onto the module rf shield cover is done at the customer's own risk. the numerous ground pins at the module perimeter should be suffcient for optimum im munity to external rf interference. fcc compliance statement (part 15.19) section 7.15 of rss-gen this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: 1. this device may not cause harmful interference. 2. this device must accept any interference received, including interference that may cause undesired operation. warning (part 15.21) changes or modifcations not expressly approved by cel could void the user's authority to operate the equipment. 20 cm separation distance to comply with fcc/ic rf exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. oem responsibility to the fcc rules and regulations the meshconnect module has been certifed per fcc part 15 rules for integration into products without further testing or certifcation. to fulfll the fcc certifcation requirements, the oem of the meshconnect module must ensure that the information provided on the meshconnect label is placed on the outside of the fnal product. the meshconnect module is labeled with its own fcc id number. if the fcc id is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording such as the following: contains transmitter module fcc id: w7z-icp0 or contains fcc id: w7z-icp0 the oem of the meshconnect module must only use the approved antenna, (pcb trace antenna) that has been certifed with this module. the oem of the meshconnect module must test their fnal product confguration to comply with uninten - tional radiator limits before declaring fcc compliance per part 15 of the fcc rules. www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 13 agency certifications (continued) ic certifcation industry canada statement the term "ic" before the certifcation / registration number only signifes that the industry canada technical specifcations were met. certifcation ic - dclaration d'industrie canada le terme "ic" devant le numro de certifcation / d'enregistrement signife seulement que les spcifcations techniques industrie canada ont t respectes. section 14 of rss-210 the installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit rf feld in excess of health canada limits for the general population. consult safety code 6, obtainable from health canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php l'article 14 du cnr-210 le programme d'installation de cet quipement radio doit s'assurer que l'antenne est situe ou oriente de telle sorte qu'il ne pas mettre de champ rf au-del des limites de sant canada pour la population gnrale. consulter le code de scurit 6, disponible sur le site web de sant canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/ index-eng.php ce certifcation europe the meshconnect rf module has been tested and certifed for use in the european union. oem responsibility to the european union compliance rules if the meshconnect module is to be incorporated into a product, the oem must verify compliance of the fnal product to the european harmonized emc and low-voltage / safety standards. a declaration of conformity must be issued for each of these standards and kept on fle as described in annex ii of the r&tte directive. the manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining european union compliance. if any of the specifcations are exceeded in the fnal product, the oem is required to make a submission to the notifed body for compliance testing. oem labeling requirements the `ce' mark must be placed on the oem product in a visible location. the ce mark shall consist of the initials ce with the following form: if the ce marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. the ce mark must be a minimum of 5mm in height the ce marking must be affxed visibly, legibly, and indelibly. since the 2400 - 2483.5 mhz band is not harmonized by a few countries throughout europe, the restriction sign must be placed to the right of the ce marking as shown in the picture www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 14 shipment, handling, and storage shipment the meshconnect modules are delivered in trays of 28. handling the meshconnect modules are designed and packaged to be processed in an automated assembly line. warning the meshconnect modules contain highly sensitive electronic circuitry. handling without proper esd protection may destroy or damage the module permanently. warning the meshconnect modules are moisture-sensitive devices. appropriate handling instructions and precautions are summarized in j-std-033. read carefully to prevent permanent da mage due to moisture intake. moisture sensitivity level (msl) msl 3, per j-std-033 storage storage/shelf life in sealed bags is 12 months at <40c and <90% relative humidity. www.datasheet.co.kr datasheet pdf - http://www..net/
meshconnect ? em357 module page 15 references & revision history previous versions changes to current version page(s) 0008-00-07-00-000 (issue es) october 14, 2010 initial preliminary datasheet. n/a 0008-00-07-00-000 (issue a) january 21, 2011 updated rf channels to 15 for fcc certifcation. updated pin out table. updated processing guidelines. 1, 5 disclaimer ? the information in this document is current as of the published date. the information is subject to change without notice. for actual design-in, refer to the latest publications of cel data sheets or data books, etc., for the most up-to-date specifcations of cel products. not all products and/or types are available in every country. please check with an cel sales representative for availability and additional information. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of cel. cel assumes no responsibility for any errors that may appear in this document. ? cel does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of cel products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of cel or others. ? descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. cel assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. ? while cel endeavors to enhance the quality, reliability and safety of cel products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely . to minimize risks of damage to property or injury (including death) to persons arising from defects in cel products, customers must incorporate suffcient safety measures in their design, such as redundancy, fre-containment and anti-failure features. www.datasheet.co.kr datasheet pdf - http://www..net/

▲Up To Search▲

Price & Availability of ZICM357P2-1

	To Download ZICM357P2-1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .